Semiconductors
The NanoTest is an ideal tool-kit for solving a wide range of mechanical reliability problems throughout the microelectronics industry.
As the size of integrated circuits continues to decrease in line with Moores Law, mechanical reliability is becoming an increasing problem due to the increased importance of thin film properties. Mechanical properties need to be optimized for improved mechanical properties and durability. To optimize these coatings effectively, rapid laboratory testing of different coatings and multi-layers is essential.
The NanoTest is used to test for variable inter-layer adhesion, fracture resistance, coating uniformity, modulus, hardness, thermal variations and scratch resistance in:
- IC bonding pads
- Passivated metal tracks
- Barrier Layers
- Flat panel displays
- Scratch resistant coatings for IR optics
- Multi-layer packaging films
- Multilevel interconnects
- Solder Bonding
- Interlayer dielectrics
- Electronic Packaging
- Low-k dielectrics
- Wire Bond Fingers
- Solder-less press fit connectors
- Conductive Ni/Au coated polymers
With its wide range of techniques for testing under true operating conditions, including high temperature testing and impact testing, the NanoTest enables a complete picture of the mechanical properties of the material to be built up rapidly.
Hardness, modulus and creep of lead-free solder at RT-200°C
Microelectronic devices are processed at elevated temperatures (up to 400°C) and also are subject to thermal cycles during use (chips in an IC can reach 150°C). The NanoTest high temperature stage enables testing and evaluation at processing and operating temperatures.
Scratch resistance of Si-doped DLC film for IR optics
Silicon doping of DLC coatings can improve adhesion to some substrates and alter the surface wettability, although at the expense of some hardness. The nano-scratch module has been used to investigate how this affects their scratch resistance.
The figure shows nano-scratch test traces together from tests on Si-containing DLC films. Failure is clearly seen as an increase in scratch depth and subsequent oscillations in the scratch trace as the probe encounters broken film. Images from the NanoTest microscope confirm total film failure.
Interlayer adhesion
Poor or variable interlayer adhesion, commonly due to a non-optimized coating procedure at high temperatures, ultimately leads to delamination and device failure. Impact and fatigue testing with the NanoTest Impact module can provide clear and reliable measurements on adhesion strength that can be used to improve overall product design and performance.
Further reading
High-temperature creep and hardness of eutectic 80Au/20Sn solder Y.C. Liu, J.W.R. Teo, S.K. Tung and K.H. Lam, J Alloys Compd. 448, 340 (2008)
Influence of experimental factors and film thickness on the measured critical load in the nanoscratch test BD Beake, AA Ogwu and T Wagner Mater Sci Eng A 423 (2006) 70.
