The NanoTest Vantage: next generation nanomechanical testing and materials development for the Microelectronics sector.

Microelectronics Applications

The microelectronics sector moves quickly: gaining a technical lead can be critical to gaining a market advantage. And key to that is having testing processes in place that can determine future performance of potential new materials and coatings offering enhanced performance – quickly, reliably and cost effectively.

Nano-scale tests to optimise reliability

Lead-containing (Sn-Pb) solder joints have been used extensively in the micro-electronics industry for decades. Whilst promising lead-free solders such as SAC (Sn-Ag-Cu) have been developed for domestic use, concerns remain over their reliability, as they are much less well characterised, particularly under working environments as experienced in micro-electronics applications where industrial studies have shown that failure rates are too high and degradation mechanisms differ from those in domestic uses.

Use the NanoTest to characterise and optimise:

• Lead-free solder - high temperature nano-indentation
• SiO2 surface wear
• Scratch testing of ta-C films
• Bending of micro-beams and cantilevers
• Fatigue of micro-beams and cantilevers (using patented nano-impact technology)
• Bond pads

Support Literature

Microelectronics

Our support literature for the Microelectronics sector will provide a great introduction to the NanoTest Vantage, learn how you could be taking advantage.

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