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The NanoTest is an ideal tool-kit for solving a wide range of mechanical reliability problems throughout the microelectronics industry.
As the size of microelectronic devices continues to decrease, mechanical reliability is becoming an increasing problem due to the increased importance of thin film properties. Mechanical properties need to be optimized for improved mechanical properties and durability. To do this effectively, rapid laboratory testing of different trial coatings and multi-layers is essential.
The NanoTest is used in research laboratories to test for variable inter-layer adhesion, fracture resistance, coating uniformity, modulus, hardness, thermal variations and scratch resistance in: |
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With its wide range of testing techniques for testing under relevant conditions, including high temperature testing and impact testing, the NanoTest enables a more complete picture of the mechanical properties of the system to be built up rapidly. Case studies provide examples:-
1) Interlayer adhesion Poor or variable interlayer adhesion, commonly due to a non-optimized coating procedure, ultimately leads to delamination and device failure. Impact and fatigue testing with the NanoTest Impact module can provide clear and reliable measurements on adhesion strength that can be used to improve overall product design, performance and yield.
2) Thermal integrity Microelectronic devices are processed at elevated temperatures (up to 400 degrees C.) and also are subject to thermal cycles during use (chips in an IC can reach 150 degrees C.). The NanoTest high temperature stage enables testing and evaluation at processing and operating temperatures.
Microelectronics Application Notes
Applications Bulletin (PDF-File) Single crystal Aluminium Films (Interconnects)
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