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The NanoTest employs continuous depth recording (CDR) to
automatically monitor the penetration of a diamond indenter into a surface.
Since the depth resolution is better than 1 nm, extremely shallow
indentations can be quantified. This is particularly valuable for testing
thin solid films and small particles. In the case of thin hard films on soft
substrates, for instance, the indentation depth should generally not exceed
10% of the film thickness in order to preclude any influence of the
substrate.
Typical NanoTest indentations involve
increasing the load on the indenter until a particular load or depth occurs,
then holding the load constant for a pre-defined period, and finally
decreasing the load on the indenter back to zero. The diamond displacement
relative to the initial surface position is monitored continuously. The
hardness and elastic modulus of the material are derived from the resultant
Depth vs. Load curve.
The results shown illustrate
the indentation behaviour of aluminium, tungsten and fused silica. As one
would expect, for a given load the indentation depth is highest for
aluminium, which is the softest material. The elastic modulus is derived
from the slope of the unloading curve and the contact area between the
indenter and plastically deformed material at maximum load. Contact areas
are determined automatically from the Depth vs. Load data. From the figure,
it can also be seen that for fused quartz, much of the on-load depth is
recovered elastically as the load on the indenter is reduced.
A 3-faceted Berkovich diamond
indenter was used. The maximum load in each case was 60 mN, the dwell period
at this load was 60 s, and the time to achieve maximum load was
approximately 30 s. For averaging, 10 indentations were produced for SiO2
and W, and 5 were produced for Al.
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